Amplifiers – Involving structure other than that of transformers per se
Patent
1989-06-12
1990-10-16
Mullins, James B.
Amplifiers
Involving structure other than that of transformers per se
330 68, 330289, H03F 100
Patent
active
049638335
ABSTRACT:
An improved high powered power amplifier, where the improvement comprises an improved grounding technique by decreasing the contact resistance, and an improved thermal transfer and dissipating technique. The heat generated by a power amplifier device is transferred and dissipated substantialy outside a chassis and is in direct contact with a heat sinking device located outside the chassis. By having the heat transfer and heat dissipation occurring outside the chassis and by having the power amplifier device in direct contact with the heat sinking device, the power amplifier is capable of reliably operating at higher power levels.
REFERENCES:
patent: 3265982 (1966-08-01), Wilhelmsen
patent: 4151479 (1979-04-01), Baba
Murase et al, "Heat Pipe Heat Sink `Heat Kicken` For Cooling of Semiconductors," The Furukawa Electric Co., Ltd.
Owner's Manual, 75 Watt Power Amplifier Deck, Model TTF 1440 (850-875 MHz), Motorola, Inc., Apr. 22, 1988.
Krause Joseph P.
Markison Timothy W.
Motorola Inc.
Mullins James B.
Parmelee Steven G.
LandOfFree
High powered amplifier and heat sinking apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High powered amplifier and heat sinking apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High powered amplifier and heat sinking apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-851975