High powered amplifier and heat sinking apparatus

Details High powered amplifier and heat sinking apparatus High powered amplifier and heat sinking apparatus

1989-06-12

1990-10-16

Mullins, James B.

Amplifiers

Involving structure other than that of transformers per se

330 68, 330289, H03F 100

Patent

active

049638335

ABSTRACT:
An improved high powered power amplifier, where the improvement comprises an improved grounding technique by decreasing the contact resistance, and an improved thermal transfer and dissipating technique. The heat generated by a power amplifier device is transferred and dissipated substantialy outside a chassis and is in direct contact with a heat sinking device located outside the chassis. By having the heat transfer and heat dissipation occurring outside the chassis and by having the power amplifier device in direct contact with the heat sinking device, the power amplifier is capable of reliably operating at higher power levels.

REFERENCES:
patent: 3265982 (1966-08-01), Wilhelmsen
patent: 4151479 (1979-04-01), Baba
Murase et al, "Heat Pipe Heat Sink `Heat Kicken` For Cooling of Semiconductors," The Furukawa Electric Co., Ltd.
Owner's Manual, 75 Watt Power Amplifier Deck, Model TTF 1440 (850-875 MHz), Motorola, Inc., Apr. 22, 1988.

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