High power thick film circuit with overlapping lead frame

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing

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Details

29626, 29577, 174 52FP, 317101CC, 357 70, 357 80, 357 81, H01B 734

Patent

active

039580750

ABSTRACT:
The lead frame for a thick film circuit has inwardly extending strip portions of substantial area which are positioned and dimensioned to substantially match and overlie selected thick film conductors to increase the current carrying capacity thereof and to act as mounting elements and heat diffusers for diodes, SCRs (silicon controlled rectifiers) and other heat-generating components.

REFERENCES:
patent: 3839660 (1974-10-01), Stryker
patent: 3881245 (1975-05-01), Dudley et al.
patent: 3885304 (1975-05-01), Kaiser et al.

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