High power semiconductor package

Details High power semiconductor package High power semiconductor package

1984-04-03

1985-08-27

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 75, 357 81, 174 52PE, 361388, H01L 2328, H01L 2316, H01L 2302

Patent

active

045381682

ABSTRACT:
A high power semiconductor package having a unitary extruded metal housing which serves as an efficient thermal heat sink and which includes integral constituents for retaining an encapsulating material. The extruded housing has open sides and an open top to facilitate installation of the semiconductor die assemblies and associated electronic components and terminals prior to enclosure in a molded or otherwise formed encapsulant.

REFERENCES:
patent: 3441813 (1969-04-01), Takatsuka et al.
patent: 3475662 (1969-10-01), Zido
patent: 3539803 (1970-11-01), Beerman
patent: 3611107 (1971-10-01), Ruckel
patent: 3649872 (1972-03-01), Garboushian
patent: 3743896 (1973-07-01), Weiske et al.
patent: 3846823 (1974-11-01), Matthews et al.
patent: 4047197 (1977-09-01), Schierz
patent: 4106052 (1978-08-01), Schierz
patent: 4107727 (1978-08-01), Ikezawa et al.
patent: 4278990 (1981-07-01), Fichot
patent: 4443655 (1984-04-01), Van Dyk Soerewyn

Affiliated with

Also associated with

Rating

High power semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High power semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High power semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2004556