High power semiconductor package

Details High power semiconductor package High power semiconductor package

1981-12-23

1985-04-30

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, 357 81, H05K 504

Patent

active

045145873

ABSTRACT:
A high power semiconductor package which includes a substantially continuous mounting surface for efficient thermal mounting to a heat sink and which can be electrically isolated or non-isolated. The package includes a metal header having a cylindrical section and a peripheral mounting flange. The cylindrical section has an annular portion adjacent to the mounting flange into which is press fitted a thermally conductive disk having an outer surface which is substantially coplanar with the mounting surface of the flange. One or more semiconductor devices are mounted within the cylindrical section in thermal communication with the conductive disk, and are electrically connected to leads which outwardly extend from the top of the header. An encapsulant can be provided within the header to enclose the semiconductor devices, and an electrically insulating cap can be secured to the cylindrical section and through which the leads extend.

REFERENCES:
patent: 2674646 (1954-04-01), Schoch
patent: 3361868 (1968-01-01), Bachman
patent: 3541478 (1970-11-01), Peterson et al.
patent: 4047197 (1977-09-01), Schierz
patent: 4394530 (1983-07-01), Kaufman

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