High power semiconductor module

Details High power semiconductor module High power semiconductor module

2006-02-28

2006-02-28

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S690000, C257S704000, C257S710000, C257S718000, C257S726000, C257S727000, C257S785000

Reexamination Certificate

active

07005739

ABSTRACT:
The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.

REFERENCES:
patent: 3515955 (1970-06-01), Butenschon
patent: 4646131 (1987-02-01), Amagasa et al.
patent: 5016088 (1991-05-01), Ermilov et al.
patent: 5705853 (1998-01-01), Faller et al.
patent: 27 31 211 (1979-01-01), None
patent: 3508456 (1986-09-01), None
patent: 0 989 611 (2000-03-01), None

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