High power semiconductor heat sink assembly

Details High power semiconductor heat sink assembly High power semiconductor heat sink assembly

1981-10-09

1985-08-27

James, Andrew J.

357 76, 357 79, H01L 2302, H01L 2332, H01L 2342

Patent

active

045381712

ABSTRACT:
A high power semiconductor heat sink assembly comprising a semiconductor slice or chip and a heat sink structure. The heat sink structure comprises two spaced apart thermally and electrically conductive plates of for example aluminum between which the slice or chip is clamped. A device such as an O-ring is sandwiched between the plates so as to extend around the slice or chip and define a sealed compartment within which the slice or chip is located. An electrically non-conductive thermally conductive material such as a resin comprising alumina fills the space between the plates outside the compartment.

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patent: 2825014 (1958-02-01), Willemse
patent: 3264531 (1966-08-01), Dickson, Jr.
patent: 3373335 (1968-03-01), Rosenberg
patent: 3437887 (1969-04-01), Nowalk et al.
patent: 3443168 (1969-05-01), Camp et al.
patent: 3651383 (1972-03-01), Livezey et al.
patent: 4099201 (1978-07-01), Mueller
patent: 4326238 (1982-04-01), Takeda et al.
"Replaceable Chip to Heat Sink Connection on Circuit Boards", W. E. Dunkel, IBM Technical Disclosure Bulletin, vol. 14, No. 11, Apr. 1972, p. 3332.

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