Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-04-28
1999-09-07
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361707, 361708, 361709, 361711, 361719, 361760, 361767, 174 163, 174 521, 174252, 165 803, H05K 720
Patent
active
059496495
ABSTRACT:
A power semiconductor device package in which a semiconductor chip is mounted on a ceramic platform and sealed thereon by a lid. The platform has opposing end portions which receive fasteners for directly fastening the platform and semiconductor device to a heat sink without the requirement of a separate mounting clamp. In one embodiment, metal films are provided on a surface of the platform adjacent to recesses for receiving the fasteners. The metal films function to distribute the stress of the fasteners over the surface of the end portions thereby minimizing the possibility of fracture of the ceramic platform.
REFERENCES:
patent: 3829598 (1974-08-01), Darnell
patent: 4394530 (1983-07-01), Kaufman
patent: 5164885 (1992-11-01), Drye et al.
patent: 5184211 (1993-02-01), Fox
patent: 5338974 (1994-08-01), Wisherd et al.
patent: 5485037 (1996-01-01), Marrs
patent: 5510649 (1996-04-01), Adhihetty et al.
patent: 5528458 (1996-06-01), Yasuho et al.
Chervinsky Boris L.
Picard Leo P.
Spectrian, Inc.
Woodward Henry K.
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