High power semiconductor device cooling apparatus and method

Details High power semiconductor device cooling apparatus and method High power semiconductor device cooling apparatus and method

1975-05-19

1977-03-01

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 76, 165 80, 165105, 174 16B, H01L 2504, H01L 2332, F28F 700, H01B 734

Patent

active

040104893

ABSTRACT:
A heat sink assembly is described for cooling right cylindrical packages containing high power semiconductor devices. Opposite end faces of the packages cooperate with heat sink members to provide liquid coolant flow channels in which the liquid coolant is in direct contact with the package end face. A unique compact elastomeric coolant manifold facilitates semiconductor device replacement in the assembly. The assembly, including the elastomeric manifold, is enclosed in a container and maintained submerged in coolant during use.

REFERENCES:
patent: 3502956 (1970-03-01), Fries et al.
patent: 3551758 (1970-12-01), Ferree
patent: 3573574 (1971-04-01), Davis
patent: 3603381 (1971-09-01), Scherbaum
patent: 3654528 (1972-04-01), Barkan
patent: 3668506 (1972-06-01), Beasley et al.
patent: 3763402 (1973-10-01), Shore et al.
patent: 3768548 (1973-10-01), Dilay et al.
patent: 3893162 (1975-07-01), Weidemann

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