Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2006-06-27
2009-02-10
Pham, Thanhha (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S099000, C257SE51032
Reexamination Certificate
active
07489031
ABSTRACT:
The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; and at least one electrical conductor electrically coupled to the electronic component and extending out of the sealed chamber. The electronic component(s) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.
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Reese Spencer D.
Roberts John K.
Gentex Corporation
Pham Thanhha
Price Heneveld Cooper Dewitt & Litton LLP
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