High power MCM package

Details High power MCM package High power MCM package

2005-09-20

2005-09-20

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S778000, C257S779000, C257S780000

Reexamination Certificate

active

06946740

ABSTRACT:
A multi-chip module that includes a conductive element to serve as an electrical connector for electrically connecting respective electrical contacts of at least two power semiconductor devices and serving as an output connector. The conductive element improving heat transfer from the power semiconductor devices through the top of the module.

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International Search Report mailed Dec. 18, 2003 for PCT Application No. PCT/US03/22160.

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