High power light-emitting diode package comprising substrate...

Details High power light-emitting diode package comprising substrate... High power light-emitting diode package comprising substrate...

2005-12-30

2009-11-03

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S081000, C257S082000, C257S433000, C257S434000, C257S680000, C257SE23080, C257SE23101, C257SE23102, C257SE33056, C257SE33058, C257SE33075

Reexamination Certificate

active

07612385

ABSTRACT:
Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability. The package structure is composed of a beacon formed on a metal or non-metal substrate having high heat conductivity to mount a high power light-emitting diode chip, to increase heat release properties; a wiring portion provided on the same line as the diode to input and output power and signals; and a reflection cup having a cavity, which may be inserted into or attached to the heat spreader or the wiring substrate, including a low temperature co-fired ceramic substrate, a high temperature co-fired ceramic substrate, or a printed circuit board.

REFERENCES:
patent: 5925898 (1999-07-01), Spath
patent: 6599768 (2003-07-01), Chen
patent: 6782610 (2004-08-01), Iijima et al.
patent: 6799864 (2004-10-01), Bohler et al.
patent: 6936855 (2005-08-01), Harrah
patent: 7042021 (2006-05-01), Isoda
patent: 7119422 (2006-10-01), Chin
patent: 7129638 (2006-10-01), Ng
patent: 7138667 (2006-11-01), Barnett et al.
patent: 7187010 (2007-03-01), Tsukagoshi
patent: 7190585 (2007-03-01), Houle
patent: 7456499 (2008-11-01), Loh et al.
patent: 2004/0227149 (2004-11-01), Ibbetson et al.
patent: 2005/0077616 (2005-04-01), Ng et al.
patent: 2005/0242362 (2005-11-01), Shimizu et al.
patent: 2006/0049475 (2006-03-01), Wang et al.
patent: 2006/0086945 (2006-04-01), Wang et al.
patent: 2006/0102917 (2006-05-01), Oyama et al.
patent: 2006/0170332 (2006-08-01), Tamaki et al.
patent: 2007/0018175 (2007-01-01), Mazzochette et al.
patent: 2007/0291503 (2007-12-01), Friedrich et al.
patent: 2008/0278954 (2008-11-01), Speier

Affiliated with

Also associated with

Rating

High power light-emitting diode package comprising substrate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High power light-emitting diode package comprising substrate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High power light-emitting diode package comprising substrate... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4103867