High power light emitting diode package and fabrication...

Details High power light emitting diode package and fabrication... High power light emitting diode package and fabrication...

2006-05-30

2010-02-16

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S676000, C438S122000

Reexamination Certificate

active

07663199

ABSTRACT:
The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.

REFERENCES:
patent: 5731067 (1998-03-01), Asai et al.
patent: 7365407 (2008-04-01), Ng et al.
patent: 2003/0183907 (2003-10-01), Hayashi et al.
patent: 2004/0075100 (2004-04-01), Bogner et al.
patent: 2006/0022216 (2006-02-01), Chikugawa
patent: 2003-289085 (2003-10-01), None
patent: 2005-116937 (2005-04-01), None

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