High-power LGA socket

Details High-power LGA socket High-power LGA socket

2008-07-22

2008-07-22

Graybill, David E (Department: 2822)

Metal working

Barrier layer or semiconductor device making

C438S117000, C438S466000

Reexamination Certificate

active

07402182

ABSTRACT:
A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion into a slot. The solid end and the scalloped edges carry current greater than the current needed for an input/output signal. The socket includes a base having an opening therein adapted to receive the package. A slot is located at one end of the opening in the base. The slot is provided with a plurality of conductors for carrying currents greater than the current needed for an input/output signal. A first edge and second edge of the opening include a plurality of spaced overhangs positioned over the opening. The overhangs are sloped with respect to the major planar surface.

REFERENCES:
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4788404 (1988-11-01), Kent
patent: 5058265 (1991-10-01), Goldfarb
patent: 5306948 (1994-04-01), Yamada et al.
patent: 5637916 (1997-06-01), Joshi
patent: 5646447 (1997-07-01), Ramsey et al.
patent: 5731709 (1998-03-01), Pastore et al.
patent: 5765280 (1998-06-01), Joshi
patent: 5864092 (1999-01-01), Gore et al.
patent: 5892275 (1999-04-01), McMahon
patent: 5917709 (1999-06-01), Johnson et al.
patent: 6040625 (2000-03-01), Ip
patent: 6043558 (2000-03-01), Manning
patent: 6054757 (2000-04-01), Kobayashi
patent: 6057600 (2000-05-01), Kitazawa et al.
patent: 6105226 (2000-08-01), Gore et al.
patent: 6113399 (2000-09-01), Hundt et al.
patent: 6368137 (2002-04-01), Orwoll
patent: 6617946 (2003-09-01), Kennedy et al.
patent: 6624645 (2003-09-01), Haseyama et al.
patent: 6624647 (2003-09-01), Adams et al.
patent: 6870251 (2005-03-01), Tran
patent: 2001/0032740 (2001-10-01), Kennedy et al.
patent: 2001/0040287 (2001-11-01), Hosomi
patent: 2003/0006792 (2003-01-01), Adams et al.
patent: 2005/0164529 (2005-07-01), Tran
patent: 0862213 (1998-09-01), None
patent: 2003-318301 (2003-11-01), None
patent: WO-89/00346 (1989-01-01), None

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