High-power LED package structure

Details High-power LED package structure High-power LED package structure

2006-01-13

2008-12-16

Truong, Bao Q (Department: 2875)

Illumination

Light source and modifier

With ventilating, cooling or heat insulating means

C362S373000, C362S800000

Reexamination Certificate

active

07465069

ABSTRACT:
A high-power LED package structure applied to spot lights, torch lights, structures that provide ultraviolet or infrared or white lights. The high-power LED package structure comprises at least one light emitting diode chip attached to an outer surface of a metallic heat sink of high heat conductivity. The structure further comprises a heat-conducting base on which the metallic heat sink is embedded. There is an insulating layer between the metallic heat sink and the heat-conducting base. The tri-structure significantly increases the mechanical toughness and the heat-conducting area of the present invention, whereby the heat produced in the metallic heat sink will be diffused quickly to the heat-conducting base and then dissipated away. Therefore, the effect of heat dissipation will be enhanced.

REFERENCES:
patent: 6340236 (2002-01-01), Hisanaga
patent: 7128454 (2006-10-01), Kim et al.
patent: 7244965 (2007-07-01), Andrews et al.
patent: 2006/0139932 (2006-06-01), Park
patent: 2007/0133209 (2007-06-01), Wang et al.

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