Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Reexamination Certificate
2000-05-09
2001-11-20
Elve, M. Alexandra (Department: 3729)
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
C228S046000, C228S049500
Reexamination Certificate
active
06318622
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to the field of hybrid module assembling, and more specifically, to the field of high power hybrid module assembling.
DESCRIPTION OF THE BACKGROUND ART
In one prior art related to hybrid module assembling, a hybrid module usually included a plurality of semiconductor chips and a plurality of Surface Mount Technology components (SMT) including resistors, conductors, inductors and other SMT components. The prior art process of manufacturing a hybrid module included the process of mounting semiconductor chips or packaged devices and SMT components on a ceramic substrate.
There are several prior art machines that do automatic die attachment for high power semiconductors. These machines utilize the standard process of scrubbing the die in a figure eight pattern to eliminate any voids under the die. The die is attached using an eutectic solder. However, the usage of these machines is a very expensive and a time consuming procedure because the die is attached to each chip at one chip at the time.
What is needed is a high power hybrid module assembling apparatus that utilizes a more time efficient and less expensive die attachment procedure.
SUMMARY OF THE INVENTION
To address the shortcomings of the available art, the present invention discloses an apparatus for a time efficient high power hybrid module assembling.
In the preferred embodiment of the present invention, the high power hybrid module assembling apparatus comprises: (a) a high power semiconductor chip pick-and-place machine configured to provide a first plurality of high power semiconductor chips; (b) a high power semiconductor chip conductive-paste. placement machine configured to provide a first conductive layer for the first plurality of high power semiconductor chips; (c) a vacuum oven configured to create a permanent electrical connection between each high power semiconductor chip and a first substrate by heating the first conductive layer in vacuum; (d) a Surface Mount Technology (SMT) pick-and-place machine configured to provide a second plurality of SMT components; (e) an SMT conductive-paste-placement machine configured to provide a second conductive layer for the second plurality of SMT components; (f) a reflow soldering machine configured to solder each SMT component to a second substrate by using the second conductive layer, wherein the second substrate includes a plurality of conductive patterns; (g) a cleaning device; (h) an automatic wire bonding machine configured to wire-bond each high power semiconductor chip to the high power hybrid module; (i) a testing machine configured to test each high power hybrid module; and (k) a lid-placement machine configured to place a lid on each tested high power hybrid module. The usage of the vacuum oven allows to process a rack of high power hybrid modules at the same time thus significantly increasing the time efficiency of the high power hybrid module assembling process.
In one embodiment of the present invention, the high power semiconductor chip conductive-paste-placement machine further comprises a stencil printer configured to put solder paste onto the first substrate in precise locations through holes in a screen, and the SMT component conductive-paste-placement machine further comprises a stencil printer configured to put solder paste onto the second substrate in precise locations through holes in the screen.
In one embodiment of the present invention, the automatic wire bonding machine further includes an ultrasonic wedge-wedge automatic wire bonding machine. In an alternative embodiment of the present invention, the automatic wire bonding machine further includes a thermosonic ball & wedge automatic wire bonding machine.
REFERENCES:
patent: 4881320 (1989-11-01), Kohle et al.
patent: 5252053 (1993-10-01), Schraven et al.
patent: 5418688 (1995-05-01), Hertz et al.
patent: 5635115 (1997-06-01), Konishi et al.
patent: 5659947 (1997-08-01), Eilers et al.
patent: 5663106 (1997-09-01), Karavakis et al.
patent: 6232151 (2001-05-01), Ozmat et al.
Hollingsworth Gregg A.
Johnson Joseph Herbert
Elve M. Alexandra
Johnson Jonathan
Tankhilevich Boris G.
Xemod, Inc.
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