High power, high density interconnect apparatus for integrated c

Details High power, high density interconnect apparatus for integrated c High power, high density interconnect apparatus for integrated c

1990-10-16

1993-02-09

Tolin, Gerald P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361412, 361414, H05K 100

Patent

active

051855020

ABSTRACT:
The present invention provides an improved method for manufacturing circuit boards with high power, high density interconnects. Printed circuit board technology, integrated circuit technology, and heavy-build electroless plating are combined to produce multilayer circuit boards comprised of substrates with different interconnect densities. In the higher density substrates, thick metallized layers are built-up by combining additive and subtractive techniques. These thicker foils minimize DC voltage drop so that conductors can run for longer distances. The conductors are substantially more square than their thin film equivalents, thus providing better performance for high frequency signals. Power distribution capabilities are enhanced by the present invention, so that circuit boards fully populated with dense, high-speed, high-power integrated circuits can easily be supplied with their necessary power requirements.

REFERENCES:
patent: 2943956 (1960-07-01), Robinson
patent: 3006819 (1961-10-01), Wilson et al.
patent: 3115423 (1963-12-01), Ashworth
patent: 3240602 (1966-03-01), Johnston
patent: 3244581 (1966-04-01), Miller
patent: 3288639 (1966-11-01), Smith, Jr.
patent: 3330695 (1967-07-01), Curran
patent: 3423205 (1969-01-01), Skaggs et al.
patent: 3430104 (1969-02-01), Burgess et al.
patent: 3436327 (1969-04-01), Shockley
patent: 3487522 (1970-01-01), Harendza-Harinxma
patent: 3585010 (1971-06-01), Luce et al.
patent: 3691007 (1972-09-01), Pavlou
patent: 3704163 (1972-11-01), Limbough
patent: 3808576 (1974-04-01), Castonguay et al.
patent: 3832603 (1974-08-01), Cray et al.
patent: 3904934 (1975-09-01), Martin
patent: 4030190 (1977-06-01), Varker
patent: 4190474 (1980-02-01), Berdan et al.
patent: 4374457 (1983-02-01), Wiech, Jr.
patent: 4498122 (1985-02-01), Rainal
patent: 4514784 (1985-04-01), Williams et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4706165 (1987-11-01), Takenaka et al.
patent: 4770897 (1988-09-01), Wu
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4816323 (1989-03-01), Inoue
patent: 4899439 (1990-02-01), Potter et al.
patent: 4920639 (1990-05-01), Yee
patent: 5072075 (1991-12-01), Lee et al.
Jarvela, R. A. and J. J. Jebrani, Wirability Enhancement, IBM Disclosure, vol. 21, No. 9, Feb. 1979, p. 3624.
Proceedings of the IEEE 1988 National Aerospace and Electronics Conference (NAECON 1988), Dayton, May 23-27, 1988, vol. 1 of 4, IEEE D.C. Blazej et al.: "Enabling Technologies for Achieving Avionics Modularization".

Affiliated with

Also associated with

Rating

High power, high density interconnect apparatus for integrated c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High power, high density interconnect apparatus for integrated c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High power, high density interconnect apparatus for integrated c will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-326899