High power electronic package with enhanced cooling...

Details High power electronic package with enhanced cooling... High power electronic package with enhanced cooling...

2005-09-13

2005-09-13

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C361S688000, C361S704000, C257S706000

Reexamination Certificate

active

06943293

ABSTRACT:
A power electronics module includes a heat sink and an electronic package having a first layer in direct thermal communication with the heat sink. At least one electronic component is disposed between the first layer and a second layer. A thermally conductive element is in direct thermal communication with the second layer and carries heat from a first portion of the second layer to a second portion of the second layer such that the heat is transferred from the second portion of the second layer to the heat sink through the first layer.

REFERENCES:
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5940271 (1999-08-01), Mertol
patent: 6563712 (2003-05-01), Akram et al.
patent: 6845012 (2005-01-01), Ohkouchi
patent: 6873043 (2005-03-01), Oman

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