High power dissipation vertical mounted package for surface moun

Details High power dissipation vertical mounted package for surface moun High power dissipation vertical mounted package for surface moun

1994-05-12

1995-07-11

LeDynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361772, 361773, 361825, 174260, 174261, 257690, 257692, 257696, 257784, H05K 702

Patent

active

054326788

ABSTRACT:
A mounting device (170) of a semiconductor integrated circuit (202) allows edge mounting on surface of a printed circuit board (250). The mounting device includes a top portion (150) to provide for cooling and protection of the semiconductor chip while a side portion (140) provides for cooling and positioning on the printed circuit board.

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