High power chip cooling device and method of manufacturing same

Details High power chip cooling device and method of manufacturing same High power chip cooling device and method of manufacturing same

1983-10-24

1985-08-20

Ramsey, Kenneth J.

Heat exchange

Heat transmitter

2281736, 228183, 29423, 156155, 165 80A, 165 81, H01L 2336

Patent

active

045358419

ABSTRACT:
A leaf-type cooling device for coupling a semi-conductor chip package to a heat sink is formed by accordion pleated folding of two copper strips coated on their non-mating sides with solder and their mating sides with polysulfone and then using heat to solder the non-mating surfaces of strip folds together and the ridges defined by the folds to respective opposed solderable supports. The polysulfone adhesive is thereafter removed by solvation to form interleaved fins between the supports. Springs function to bias the supports away from each other.

REFERENCES:
patent: 2491258 (1980-12-01), Fuhrhop et al.
patent: 2965819 (1980-12-01), Rosenbaum
patent: 3095037 (1963-06-01), Bohm
patent: 3180404 (1965-04-01), Nelson et al.
patent: 3239003 (1966-03-01), Boudette et al.
patent: 3789494 (1974-02-01), Bostrom et al.
patent: 4026455 (1977-05-01), Huebner et al.
patent: 4270604 (1981-06-01), Nakamura
patent: 4286365 (1981-09-01), Creighton

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