High power ceramic microelectronic package

Details High power ceramic microelectronic package High power ceramic microelectronic package

1992-06-24

1994-05-10

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257669, 257779, 361767, 361813, H05K 720

Patent

active

053113993

ABSTRACT:
A microelectronic package comprising a ceramic substrate (22) having a first surface bonded to a metal heat sink (25) and a second surface (30) opposite said first surface and having at least one metallized island (32) bonded to a lead frame (26), wherein the island has a uniform pullback (35) of metallization from the edge (36) of the substrate.

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"Brazing of Aluminum Nitride Substrates", (M. G. Norton, J. M. Kajda, B. G. H. Steele)--Oct. 1990--pp. 2172-2176--J. Mater. Res., vol. 5, No. 10.
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