High planarity and low thermal coefficient of expansion base for

Details High planarity and low thermal coefficient of expansion base for High planarity and low thermal coefficient of expansion base for

1996-11-08

1998-11-03

McKane, Joseph

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

428678, 442181, B32B 3500

Patent

active

058305653

ABSTRACT:
The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base, a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.

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