High placement accuracy wire bonder for joining small closely sp

Details High placement accuracy wire bonder for joining small closely sp High placement accuracy wire bonder for joining small closely sp

1994-04-25

1995-03-07

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 11, 228 45, H01C 2160

Patent

active

053950380

ABSTRACT:
An automated wire bonding tool for interconnecting circuit pads on microelectronic circuit devices and substrates. A single application of the bonding tool spans both bond sites with the wire being held under the bond tool and gripped at both ends while bonding the wire to both bond sites simultaneously and with high placement accuracy.

REFERENCES:
patent: 4619397 (1986-10-01), Urban
patent: 5084107 (1992-01-01), Deguchi et al.
patent: 5288007 (1994-02-01), Interrante et al.

Affiliated with

Also associated with

Rating

High placement accuracy wire bonder for joining small closely sp does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High placement accuracy wire bonder for joining small closely sp, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High placement accuracy wire bonder for joining small closely sp will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1401366