High pin count chip carrier package

Details High pin count chip carrier package High pin count chip carrier package

1986-04-07

1987-08-18

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 52FP, 361400, 361414, H05K 118

Patent

active

046881506

ABSTRACT:
A semiconductor chip carrier system has a printed circuit board supporting a plurality of ceramic carrier packages in rows and columns; each package has a plurality of flexible electrical conductive connection pads. A plurality of pressure exerting retaining means engage columns of the ceramic packages. The ends of the retaining means are connected to the printed circuit board for retaining the flexible electrical conductive connection pads of the columns of ceramic carrier packages in electrical contact with the printed circuit board thereby eliminating the need for solder connections.

REFERENCES:
patent: 2772382 (1956-11-01), Escoffery
patent: 3842189 (1974-10-01), Southgate
patent: 3867003 (1975-02-01), Morton et al.
patent: 3982308 (1976-09-01), Yoneda
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4150420 (1979-04-01), Berg
patent: 4203129 (1980-05-01), Oktay et al.
patent: 4296456 (1981-10-01), Reid
patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4415025 (1983-11-01), Horvath
patent: 4442450 (1984-04-01), Lipshutz
Ciancanelli, "Circuit Module with Heat Transfer" IBM Technical Disclosure Bulletin, vol. 9, No. 7, Dec. 1976, p. 2652.

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