High performance test head and method of making

Details High performance test head and method of making High performance test head and method of making

1990-07-31

1992-02-25

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 324158P, H01R 906, B01R 100

Patent

active

050901184

ABSTRACT:
A high performance test head (18) communicates test signals between integrated circuit test pads and integrated circuit tester. Test head (18) comprises metal bumps (22) that electrically couple with test pads to communicate test signals between test pads and test circuitry. Planar foundation plate (30) provides structural support. Compliant material layer (26) associates with metal bumps (22) and compresses to assure positive contact between metal bumps (22) and test pads. Compliant material layer (26) is positioned between foundation plate (30) and metal bumps (22). Interconnection line (20) adjoins test head (18) to connect metal bumps (22) between test circuitry and integrated circuits. The present invention includes a method for high performance communication of test signals between test pads and test circuitry. The present invention further includes the method of applying semiconductor device fabrication techniques to produce a high performance test head (18).

REFERENCES:
patent: 4968589 (1990-11-01), Perry
"P6521 Very High Density High Performance Probe Card", by Tektronix, Inc., copyrighted 1988.
"New Probe Cards Replace Needle Types", by Barsotti et al., Semiconductor International, Aug. 1988, pp. 98-101.
"A Coplanar Waveguide Primer", by Bachert, RF Design, Jul. 1988, pp. 52 and 54.

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