High performance system-on-chip using post passivation process

Details High performance system-on-chip using post passivation process High performance system-on-chip using post passivation process

2005-03-29

2008-12-02

Smith, Zandra V. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S379000, C257S516000, C257S758000, C257S759000, C257S760000, C438S171000, C438S190000, C438S210000, C438S238000, C438S329000, C438S381000

Reexamination Certificate

active

07459761

ABSTRACT:
The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a layer of passivation or on the surface of a thick layer of polymer. In addition, the process of the invention provides a method for mounting discrete electrical components at a significant distance removed from the underlying silicon surface.

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