Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-11-03
1997-08-26
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165126, H05K 720
Patent
active
056616384
ABSTRACT:
A thermally conductive heat sink unit. In the present invention, a thermally conductive heat sink has a first surface. A plurality of arc-shaped cooling fins are formed in the first surface. The arc-shaped cooling fins extend radially outward from a central region of the first surface. A second surface of the thermally conductive heat sink is adapted to thermally contact a heat generating device. By contacting the heat generating device, heat generated by the device is dissipated through the arc-shaped cooling fins of the first surface. In one embodiment of the present invention, a recessed region is formed into the first surface of the thermally conductive heat sink. The recessed region is formed above the central region and the region peripherally surrounding the central region such that the recessed region extends into a portion of the arc-shaped cooling fins. In such an embodiment, a fan is embedded within the recessed region of the thermally conductive heat sink. The fan impinges the arc-shaped cooling fins and the central region with a stream of coolant to aid in the dissipation of heat from the thermally conductive heat sink. In one embodiment, the arc-shaped cooling fins are arranged to insure optimal heat transfer via the stream of coolant impinging and flowing by the arc-shaped cooling fins.
REFERENCES:
patent: 3592260 (1971-07-01), Berger
patent: 4838041 (1989-06-01), Bellows et al.
patent: 5132780 (1992-07-01), Higgins, III
patent: 5409352 (1995-04-01), Lin
Silicon Graphics Inc.
Thompson Gregory D.
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