High performance semiconductor component with heat dissipating d

Details High performance semiconductor component with heat dissipating d High performance semiconductor component with heat dissipating d

1979-12-18

1982-06-01

James, Andrew J.

357 79, 357 65, 357 68, H01L 2348, H01L 2940, H01L 2302

Patent

active

043331025

ABSTRACT:
On the two main surfaces of a semiconductor disc of a large diameter, high-performance semiconductor component, there are soldered one bundle each of metal wires. The other ends of the metal wires are soldered to heat dissipating discs. The metal wires, with increasing distance from the center, are of increasing lengths in order to absorb the differences in the thermal expansion of the semiconductor disc and the heat dissipating discs. Metal ring portions and a ceramic housing complete the semiconductorcomponent. A secure and desirable contact of the semiconductor discs is achieved without the application of pressure.

REFERENCES:
patent: 2906930 (1959-09-01), Raithel
patent: 3273029 (1966-09-01), Ross
patent: 3295089 (1966-12-01), Moore
patent: 3387191 (1968-06-01), Fishman et al.
patent: 3675089 (1972-07-01), Hantusch et al.
patent: 3969754 (1976-07-01), Kuniya et al.
patent: 4067104 (1978-01-01), Tracy

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