Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate
2006-04-04
2006-04-04
Nguyen, Tuyen T (Department: 2832)
Inductor devices
Coil or coil turn supports or spacers
Printed circuit-type coil
C257S531000
Reexamination Certificate
active
07023315
ABSTRACT:
A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.
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Chew Kok Wai Johnny
Do Manh Anh
Ma Jianguo
Tan Hai Peng
Yeo Kiat Seng
Chartered Semiconductor Manufacturing Ltd.
Nguyen Tuyen T
Pike Rosemary L. S.
Saile George D.
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