High performance pressure sensitive adhesive tapes and process f

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

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428354, 428355, C09J 702

Patent

active

051007282

ABSTRACT:
A pressure sensitive adhesive tape comprises a carrier layer having a thickness of 0.25 to 2.0 millimeter and comprising an electron beam cured pressure sensitive adhesive matrix, 10 to 20% by volume low density microspheres and at least one pigment in an amount sufficient to color the tape. Preferably, fumed silica is present in an amount up to 5% by weight. The tape preferably has a kin layer on each side of the carrier layer. The skin layer has a coating thickness of 25 to 125 g/m.sup.2 and comprises a pressure sensitive adhesive matrix free of rigid, low density microspheres. The process comprises first preparing an adhesive composition containing electron beam-curable adhesive polymer matrix, fillers and solvent. The composition is introduced and conveyed through a twin screw extruder. In the extruder, solvent is removed in one or more solvent removal units, and a solvent-free composition is extruded as the carried layer. Skin layers may be co-extruded with the carrier layer.

REFERENCES:
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patent: 4330590 (1982-05-01), Vesley
patent: 4522870 (1985-06-01), Esmay
patent: 4599265 (1986-07-01), Esmay
patent: 4612242 (1986-09-01), Vesley et al.
patent: 4666771 (1987-05-01), Vesley et al.
patent: 4748061 (1988-05-01), Vesley
patent: 4818610 (1989-04-01), Zimmerman et al.

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