High performance pressure sensitive adhesive tapes

Details High performance pressure sensitive adhesive tapes High performance pressure sensitive adhesive tapes

1990-10-26

1993-01-19

Lesmes, George F.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428343, 428354, 428355, 428347, 427208, B32B 712

Patent

active

051806355

ABSTRACT:
A pressure sensitive adhesive tape comprises a carrier layer having a thickness of 0.1 to 4.0 millimeter and comprising a rubber based pressure sensitive adhesive matrix including a polythiol crosslinking agent and 10 to 30% by volume low density microspheres. Preferably, at least one pigment is present in an amount sufficient to color the tape. Fumed silica is preferably present in an amount up to 5% by weight. The tape preferably has a skin layer on each side of the carrier layer. The skin layer has a coating thickness of 25 to 125 g/m.sup.2 and comprises a pressure sensitive adhesive matrix preferably the same as the carrier layer which is free of rigid, low density microspheres.

REFERENCES:
patent: 4223067 (1980-09-01), Levens
patent: 4404246 (1983-09-01), Charbonneau et al.
patent: 4522870 (1985-06-01), Esmay
patent: 4612242 (1986-09-01), Vesley et al.
patent: 4666771 (1987-05-01), Vesley et al.
patent: 4748061 (1988-05-01), Vesley
patent: 4818610 (1989-04-01), Zimmerman et al.
patent: 4820746 (1989-04-01), Rice et al.
patent: 4855170 (1989-08-01), Darvell et al.
patent: 4950537 (1990-08-01), Vesley et al.
patent: 5100728 (1992-03-01), Plamthottam et al.

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