Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent
1989-09-05
1990-12-04
James, Andrew J.
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific current responsive fault sensor
357 81, 357 74, 361386, H01L 2328, H01L 2302
Patent
active
049757610
ABSTRACT:
A high performance plastic-encapsulated integrated circuit package is disclosed having both improved heat dissipation and low ground noise comprising one or more separate ground and/or power planes below the signal lines which includes an electrically conductive heat sink member on which an integrated circuit die is centrally and directly mounted for dissipating heat while providing electrical insulation therebetween and which may also may function as a ground or power plane, a peripheral printed circuit board having electrically conductive members formed on one or more surfaces thereof, one surface of which is also mounted to the heat sink and electrically separated therefrom and which surrounds the centrally mounted die on the heat sink, and a lead frame assembly bonded to an opposite surface of the printed circuit board. Terminal pads on the die are connected respectively to leads on the lead frame, to the electrically conductive members on the printed circuit board, and to the electrically conductive heat sink. Terminal pads on one surface of the printed circuit board may be used in combination with electrically conductive vias to provide electrical connection to the other surface of the printed circuit board as well as to the electrically conductive heat sink.
REFERENCES:
patent: 3838984 (1974-10-01), Crane et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4288841 (1981-09-01), Gogal
patent: 4380566 (1983-04-01), Phy
patent: 4407007 (1983-09-01), Desai et al.
patent: 4410927 (1983-10-01), Butt
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4725878 (1988-02-01), Miyauchi et al.
patent: 4801999 (1989-01-01), Hayward et al.
patent: 4866571 (1989-09-01), Butt
Advanced Micro Devices , Inc.
James Andrew J.
Nguyen Viet Q.
Taylor John P.
LandOfFree
High performance plastic encapsulated package for integrated cir does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High performance plastic encapsulated package for integrated cir, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High performance plastic encapsulated package for integrated cir will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-886438