High-performance package for monolithic microwave integrated cir

Details High-performance package for monolithic microwave integrated cir High-performance package for monolithic microwave integrated cir

1988-09-30

1990-02-13

Gensler, Paul

Wave transmission lines and networks

Coupling networks

With impedance matching

333204, 333246, 357 74, 357 80, H01P 500

Patent

active

049010417

ABSTRACT:
The present invention incorporates a specially-designed low-pass filter into the feedthrough of a monolithic microwave integrated circuit (MMIC) to provide compensation for discrepancies from the impedance required for an MMIC package to be matched to a transmission line. The compensation allows all parameters to be adjusted and the complete filter to be printed.
The main features of the invention include minimum width for the under-wall conductor and brazing metallization, two open-circuited stubs at the package-die interface for wire bonding ease, and metal-filled vias connecting the ground plane base and the lid sealing ring to bring the lid sealing ring to RF ground.
The present ivention also includes a method for designing the desired feedthrough that obviates the need for scale-model feedthrough design before printing, a prior art method that requires precision in the scale model. An electrical model of a feedthrough is first derived. The electrical model is then adjsuted according to the parameters desired for a new, compensated feedthrough using any known method, including software such as Touchstone. Finally, the new feedthrough is fabricated based upon the adjusted electrical model.

REFERENCES:
patent: 4172261 (1979-10-01), Tsuzuki et al.
patent: 4259684 (1981-03-01), Dean et al.
patent: 4453142 (1984-06-01), Murphy
patent: 4626805 (1986-12-01), Jones
Bettner et al, A Low Cost "Monolithic-Monolithic" Gain Module, Microwave Journal, Dec. 1987, pp. 109, 110, 112 & 113.

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