High performance optoelectronic packaging assembly

Details High performance optoelectronic packaging assembly High performance optoelectronic packaging assembly

2006-07-04

2006-07-04

Lee, John D. (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

Reexamination Certificate

active

07070340

ABSTRACT:
Optoelectronic packaging assemblies for optically and electrically interfacing a protected electro-optical device or system to both an optical fiber and to external circuitry. Such assemblies are comprised of body components that are comprised of plastic that coated or plated with a conductive material. Electrical contact pins in the form of transmission lines are used to couple external electrical signals with the package. The optoelectronic packaging assemblies are dimensioned with small cavities and with steps, breaks, walls, and/or fins molded into the body components. The optoelectronic packaging assemblies further include an optical input receptacle for receiving an optical ferrule and an optical fiber. The optoelectronic packaging assembly provides for cooling, such as by heat sink fins and/or a thermal-electric-cooler. The transmission line pins and body components are dimensioned to mate with a standardized circuit board having transmission line traces.

REFERENCES:
patent: 4802178 (1989-01-01), Ury
patent: 4873566 (1989-10-01), Hokanson et al.
patent: 4920262 (1990-04-01), Aiki et al.
patent: 5005178 (1991-04-01), Kluitmans et al.
patent: 5436997 (1995-07-01), Makiuchi et al.
patent: 6207950 (2001-03-01), Verdiell
patent: 6252726 (2001-06-01), Verdiell
patent: 6498294 (2002-12-01), Kuwahara et al.
patent: 6663294 (2003-12-01), Crane et al.
patent: 2001-237482 (2001-08-01), None

Affiliated with

Also associated with

Rating

High performance optoelectronic packaging assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High performance optoelectronic packaging assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High performance optoelectronic packaging assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3530397