High performance molding compounds for shielding electromagnetic

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

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252506, 252511, 524439, 524440, 524441, 524495, 523137, 523451, 523457, 523458, 523459, 523468, 523440, 523512, 523513, 264104, 264105, H01B 102

Patent

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044746857

ABSTRACT:
High shielding efficiencies to emissions of electromagnetic interference are achieved with molding compositions comprised of thermosetting resins and a multi-component electroconductive filler system. Compounds having a combination of at least two conductive fillers provide shielding efficiencies of 30 dB of attenuation or more to electromagnetic emissions over a frequency range of 0.5 to 1000 Mhz without adversely affecting mechanical properties and processing capabilities.

REFERENCES:
patent: 3563933 (1971-02-01), Stover
patent: 4115508 (1978-09-01), Hughes
patent: 4197218 (1980-04-01), McKaveney
patent: 4281284 (1981-07-01), Stutz et al.
"Conductive Composites for EMI Shielding", Battelle Columbus Laboratories, 6-14-78.

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