High performance microprocessor power delivery solution...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S704000, C361S760000, C361S720000, C174S260000, C174S016300

Reexamination Certificate

active

06862184

ABSTRACT:
An electronic assembly is disclosed which includes a printed circuit board. A computer processor package is centrally positioned on an upper surface of the printed circuit board. A computer processor is positioned on an upper surface of the computer processor package. A first plurality of power delivery components is positioned on an upper surface of the printed circuit board on one side of the computer processor package. One or more additional pluralities of power delivery components may be positioned on the upper surface of the printed circuit board on other sides of the computer processor package. A high frequency current may be routed from one or more of the first and/or additional pluralities of power delivery components over an elongate flex circuit to the computer processor. A series of decoupling capacitors may be coupled to the elongate flex circuit to enhance a transfer of high frequency current over the elongate flex circuit.

REFERENCES:
patent: 5963427 (1999-10-01), Bollesen
patent: 5980267 (1999-11-01), Ayers et al.
patent: 6191945 (2001-02-01), Belady et al.
patent: 6285550 (2001-09-01), Belady
patent: 6452113 (2002-09-01), Dibene
patent: 6452804 (2002-09-01), Dibene
patent: 6594556 (2003-07-01), Agatstein et al.
patent: 20020105791 (2002-08-01), Harrison et al.
patent: 20030062602 (2003-04-01), Frutschy et al.
patent: 20030181075 (2003-09-01), Hartke et al.
patent: 20030198033 (2003-10-01), Panella et al.
patent: 20030202330 (2003-10-01), Lopata et al.

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High performance microprocessor power delivery solution... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High performance microprocessor power delivery solution..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High performance microprocessor power delivery solution... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3401201

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.