High performance large tolerance heat sink

Details High performance large tolerance heat sink High performance large tolerance heat sink

2011-08-09

2011-08-09

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S705000, C361S711000, C361S719000, C165S080300, C165S104330, C165S185000, C257S706000, C257S713000, C257S718000

Reexamination Certificate

active

07995344

ABSTRACT:
A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.

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Shu Zhang; Thermal Management in RF Packages; EMPFASIS; http://www.empf.org/empfasis/mar04/thermal.htm, Jan. 9, 2006.

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