High performance interconnect system for an integrated circuit

Details High performance interconnect system for an integrated circuit High performance interconnect system for an integrated circuit

1989-08-14

1990-06-12

James, Andrew J.

357 47, 357 65, 357 67, 357 69, 357 72, H01L 2348, H01L 2328, H01L 2702

Patent

active

049337432

ABSTRACT:
A semiconductor integrated circuit device includes a high performance interconnect structure which comprises a plurality of interconnects, with each interconnect being structurally separated from the remaining interconnects except at electrical contact points. In one embodiment, each interconnect is substantially surrounded by a layer of dielectric material, there being gaps between each adjacent layer of surrounding dielectric material. Another embodiment, a layer of electrically conductive material is formed over the surrounding dielectric layer preferably filling in the gaps between adjacent layers of surrounding dielectric material. The layer of electrically conductive material acts as a ground plane and heat sink.

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