Metal working – Method of mechanical manufacture – Electrical device making
Patent
1977-07-15
1979-05-15
Keenan, Michael J.
Metal working
Method of mechanical manufacture
Electrical device making
361401, H05K 330
Patent
active
041539885
ABSTRACT:
A high performance package for integrated circuit semiconductor devices in which decoupling capacitors are provided in close proximity to the integrated circuit devices for reducing voltage variations in the power driver lines, and/or a ground plate overlying the stripe metallurgy on the surface of the substrate for reducing cross-talk between signal lines. The decoupling capacitors are each comprised of a conductive layer on the inside of a via hole, a concentric dielectric layer on the conductive layer, and an electrically conductive plug in physical contact with the dielectric layer that is associated with the driver line circuitry of the package.
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Radovsky et al; "Through Hole Plating"; IBM Technical Disclosure Bulletin; vol. 3, No. 5, Oct., 1960.
International Business Machines - Corporation
Keenan Michael J.
Stoffel Wolmar J.
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