High performance integrated circuit packaging structure

Details High performance integrated circuit packaging structure High performance integrated circuit packaging structure

1986-11-12

1989-03-07

Macon, Robert S.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 74, 357 75, 174 685, H01L 3902, H01L 2302, H01L 2312

Patent

active

048110825

ABSTRACT:
A high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures. The preferred embodiment comprises an interposer having a base substrate having alternating insulation and conductive layers thereon, wherein a plurality of the conductive layers are wiring means which are adapted for maintaining an extremely low noise level in the package. The low noise level and low resistance and capacitance of the wiring means allows a plurality of discrete semiconductor segments to be mounted on and interconnected by the integrated circuit package with a significantly reduced number of drivers and receivers than required by Rent's Rule. Each integrated circuit structure of the present invention emulates a large chip or wafer scale integration structure in performance without having to yield the large chip or wafer, and without redundancy schemes. A plurality of these integrated circuit packaging structures are combined by decals to form a central processing unit of a computer or a portion thereof. In an alternate preferred embodiment, the base substrate of the interposer is made of silicon and any required drivers are formed therein, thus substantially eliminating the need for any drivers on each of the discrete semiconductor segments.

REFERENCES:
patent: 4667220 (1987-05-01), Lee et al.
"Packaging Technology for the NEC SX Supercomputer": IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-8, No. 4, Dec. 1985, pp. 462-467, IEEE, NY, US; T. Watari et al.
"The Electrical Design Methodology for the Package Used in the IBM 3090 Computer", Wescon Proceedings, San Francisco, CA, Nov. 19-22, 1985, vol. 29, pp. 1-8 (7/3), NY, US; E. E. Davidson et al.
"IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density", IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-3, No. 1, Mar. 1980, pp. 89-93, IEEE, NY, US; B. T. Clark et al.

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