High performance epoxy based coverlay and bond ply adhesive with

Details High performance epoxy based coverlay and bond ply adhesive with High performance epoxy based coverlay and bond ply adhesive with

1990-11-26

1992-03-10

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C08F 2000

Patent

active

050950770

ABSTRACT:
A high performance, laminating, coverlay, and bond ply adhesive material includes one or more epoxy components which inter-react with a high molecular weight polyester component through a two-stage reaction sequence. The first stage of the reaction sequence includes a reaction between a aziridine cure component and a polyester component. The second stage of the sequence involves a reaction between the aziridine/polyester component and the epoxy component(s). The resulting adhesive material provides a flexible, fully cross linked adhesive material with good Z-axis stability and without the evolution of volatile by-products. This resulting adhesive material can be used in bonding polyimide films to etched circuit patterns to provide a high temperature resistant, solvent resistant, moisture resistant, insulating material with good flow properties under normal electronic circuit processing and environmental conditions. The adhesive material can be used as a bond ply adhesive material for flexible base, hardboard, and multilayer electronic circuit material applications, as well as surface to surface bonding of other materials. In addition, the adhesive material, prior to the second reaction, is stable and has a long shelf life.

REFERENCES:
patent: 3079367 (1963-02-01), Fram et al.
patent: 3182041 (1965-05-01), Watkins et al.
patent: 3502618 (1970-03-01), Uelzmann et al.
patent: 3576786 (1971-04-01), Kalfayan et al.
patent: 3580799 (1971-05-01), Uelzmann et al.

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