High performance epoxy based coverlay and bond fly adhesive with

Details High performance epoxy based coverlay and bond fly adhesive with High performance epoxy based coverlay and bond fly adhesive with

1992-03-06

1993-03-16

Herbert, Jr., Thomas J.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Halogen containing compound

156330, 1563311, 1563315, 428343, 428457, 4284735, B32B 712, B32B 1504, C09J 400

Patent

active

051943077

ABSTRACT:
A high performance, laminating, coverlay, and bond ply adhesive material includes one or more epoxy components which inter-react with a high molecular weight polyester component through a two-stage reaction sequence. The first stage of the reaction sequence includes a reaction between a aziridine cure component and a polyester component. The second stage of the sequence involves a reaction between the aziridine/polyester component and the epoxy component(s). The resulting adhesive material provides a flexible, fully cross linked adhesive material with good Z-axis stability and without the evolution of volatile by-products. This resulting adhesive material can be used in bonding polyimide films to etched circuit patterns to provide a high temperature resistant, solvent resistant, moisture resistant, insulating material with good flow properties under normal electronic circuit processing and environmental conditions. The adhesive material can be used as a bond ply adhesive material for flexible base, hardboard, and multilayer electronic circuit material applications, as well as surface to surface bonding of other materials. In addition, the adhesive material, prior to the second reaction, is stable and has a long shelf life.

REFERENCES:
patent: 3079367 (1963-02-01), Fram et al.
patent: 3182041 (1965-05-01), Watkins et al.
patent: 3502618 (1970-03-01), Uelzmann et al.
patent: 3576786 (1971-04-01), Kalfayan et al.
patent: 3580799 (1971-05-01), Uelzmann et al.
patent: 5095077 (1992-03-01), Gardeski

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