High performance dual-in-line memory (DIMM) array liquid...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S707000, C361S715000, C361S719000, C361S720000, C165S104330, C439S196000, C257S714000, C257S719000

Reexamination Certificate

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07965509

ABSTRACT:
A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit.

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