High performance dense wire for printed circuit board

Details High performance dense wire for printed circuit board High performance dense wire for printed circuit board

2005-05-17

2005-05-17

Paladini, Albert W. (Department: 2125)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S262000

Reexamination Certificate

active

06894228

ABSTRACT:
A method and structure for implementing dense wiring, in printed circuit board or chip carrier applications, which provides superior electrical characteristics while preserving the system resistance and characteristic impedance requirements. The dense wiring is characterized by requiring that all wires have a sufficient cross-sectional area to ensure the longest wires used do not exceed a maximum resistance by either sorting wire lengths and allowing acceptably “short” wires to use denser circuit lines or by providing short lengths of short circuit lines in those areas where necessary and switching to less dense, lower resistance lines where possible. The disclosure also provides for dense wiring in component areas that can then be converted to low resistance wiring with application of a buried via.

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