High performance circuit boards

Details High performance circuit boards High performance circuit boards

1988-03-07

1989-09-19

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29830, H05K 100, H05K 300

Patent

active

048683507

ABSTRACT:
The invention features a method of fabricating a printed circuit board having improved circuit board performance. The circuit board utilizes low dielectric materials having dielectric constants of less than 3.0. The dielectric layers are spaced apart from plated through-holes, thus eliminating the interface between the metallized surface of the through-hole and the dielectric sheet. Thus, the low dielectric layer is not required to be plated.
The lower dielectric character of the laminates improves wiring density, circuit speed, and provides for thinner laminates and cores.

REFERENCES:
patent: 3972755 (1976-08-01), Misfeldt
patent: 4591659 (1986-05-01), Leibowitz
patent: 4644093 (1987-02-01), Yoshihara et al.
patent: 4661301 (1987-04-01), Okada et al.
patent: 4747897 (1988-05-01), Johnson
patent: 4755783 (1988-07-01), Fleischer et al.
patent: 4755911 (1988-07-01), Suzuki

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