High performance and high capacitance package with improved ther

Details High performance and high capacitance package with improved ther High performance and high capacitance package with improved ther

1996-04-16

1997-03-04

Picardat, Kevin

Fishing, trapping, and vermin destroying

437211, 437214, 437218, 437221, H01L 2160

Patent

active

056078838

ABSTRACT:
A thermally dissipative IC package which can accommodate large discrete capacitors. The package substrate incorporates a recessed region on one of its surfaces which is separate from the region in which the IC device is placed. Inside this recessed region is placed a discrete capacitor such that the entire capacitor resides below the surface of the substrate within the recessed region. Finally, a metal plate is attached to the surface of the substrate, unencumbered by the discrete capacitor.

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