High performance adhesive

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C428S423100, C428S500000, C522S116000, C522S117000, C522S120000, C522S114000

Reexamination Certificate

active

07056408

ABSTRACT:
A method is provided for bonding substrates using a homogeneous fluid and a polymerizing condition. Also provided are composite articles formed by such a method. The composite articles show improved adhesion between the substrates and the adhesive composition over a wide range of temperatures.

REFERENCES:
patent: 3773710 (1973-11-01), Victorius
patent: 4720317 (1988-01-01), Kuroda et al.
patent: 5202361 (1993-04-01), Zimmerman et al.
patent: 5384341 (1995-01-01), Itagaki et al.
patent: 5747551 (1998-05-01), Lewandowski et al.
patent: 5900473 (1999-05-01), Huber et al.
patent: 5955512 (1999-09-01), Numazawa et al.
patent: 5997682 (1999-12-01), Goodman et al.
patent: 6069219 (2000-05-01), McCormick et al.
patent: 6191184 (2001-02-01), Suzuki et al.
patent: 6608143 (2003-08-01), Fukuoka et al.
patent: 0 263 686 (1988-04-01), None
patent: 0 264 705 (1988-04-01), None
patent: 0 340 906 (1989-11-01), None
patent: 59105068 (1985-06-01), None
PTO Translation in English of JP 59-105068 to Koji Nakamoto, published Jun. 1985.

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