Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2011-07-12
2011-07-12
Mruk, Brian P (Department: 1761)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C134S002000, C134S022140, C134S022190, C510S175000, C510S176000, C510S367000, C510S372000, C510S466000, C510S504000, C423S325000
Reexamination Certificate
active
07976638
ABSTRACT:
A composition for removing particulate matter from integrated circuit substrates, including (a) one or more metal ion-free base; (b) a water-soluble metal ion-free onium salt of a polyhedral silsesquioxane; (c) an oxidizing agent; and (d) metal ion-free water, and a composition obtained by combining ingredients including (a), (b), (c) and (d). A process for removing particulate matter from a surface of an integrated circuit device, including applying to the surface the composition including (a), (b), (c) and (d) or applying to the surface the composition obtained by combining ingredients including (a), (b), (c) and (d).
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Mruk Brian P
Renner , Otto, Boisselle & Sklar, LLP
Sachem, Inc.
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