High-molecular weight polyorganosilyl silicate and process for p

Details High-molecular weight polyorganosilyl silicate and process for p High-molecular weight polyorganosilyl silicate and process for p

1995-03-24

1997-11-11

Glass, Margaret

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

556455, 528 10, 10628712, 10628713, 10628716, C08G 7718

Patent

active

056865503

ABSTRACT:
A high-molecular weight polyorganosilyl silicate having a weight-average molecular weight of 30,000 to 2,000,000 on polystyrene conversion in which the repeating units form a ladder structure through siloxane bonding, and the ladder structures are further bonded together through siloxane bonding is disclosed. Also disclosed is a process for producing the polymer. The polymer is useful as a coating material or a film-forming material to provide a coating film or a film having excellent electrical characteristics, weather resistance, adhesion, water repellency, processability and scratch resistance.

REFERENCES:
patent: 2416503 (1947-02-01), Trautman et al.
patent: 2698314 (1954-12-01), Rust
patent: 3250743 (1966-05-01), Feltzen et al.
patent: 3615272 (1971-10-01), Collins et al.
patent: 4510283 (1985-04-01), Takeda et al.
patent: 5011901 (1991-04-01), Fukutani
patent: 5047492 (1991-09-01), Weidner et al.
patent: 5070175 (1991-12-01), Tsumura et al.
patent: 5110890 (1992-05-01), Butler
patent: 5256741 (1993-10-01), Ogawa et al.
patent: 5399648 (1995-03-01), Yamamoto et al.

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