Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming nonmetal coating using specified waveform other than...
Patent
1991-01-22
1992-06-16
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Forming nonmetal coating using specified waveform other than...
204430, 338 35, 7333502, 205135, 205159, 205162, 205221, 205317, C25D 902
Patent
active
051222370
ABSTRACT:
A high molecular humidity sensor and manufacturing method thereof in which polypyrrole being of conductive high molecule is electrochemically polymerized and then reduced whereby ionic conductive property is given go that humidity sensibility becomes excellent.
The high molecular humidity sensor of the invention is characterized in that it is a structure in which polypyrrole doped with dodecylsulfate anion DS.sup.- is stuck in film form on the surface of fine electrode, and cations Na.sup.+, K.sup.+ are permeated to said polypyrrole whereby salt is formed, and humidity sensibility is exhibited in region of 10.sup.4 -10.sup.6 .OMEGA., and humidity sensing speed becomes within several tens seconds to several minutes.
REFERENCES:
patent: 4562725 (1986-01-01), Oka et al.
patent: 4563263 (1986-01-01), Oyama et al.
patent: 4707244 (1987-11-01), Harman, III et al.
patent: 4791374 (1988-12-01), Yodice et al.
patent: 4798664 (1989-01-01), Yamaguchi et al.
patent: 4867860 (1989-09-01), Siddiqui et al.
Hwang In-seok
Kim Chung Y.
Kim Jai K.
Rhee Hee-Woo
Korea Institute of Science and Technology
Mayekar Kishor
Niebling John
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