High modulus toughened polyamide composition

Details High modulus toughened polyamide composition High modulus toughened polyamide composition

1991-06-05

1993-08-24

Schofer, Joseph L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

525 66, 525179, C08L 5100

Patent

active

052389901

ABSTRACT:
A thermoplastic composition is provided which comprises a polyamide, a grafted polymer of an isomonoolefin and an alkylstyrene, such as a maleic anhydride-grafted copolymer of isobutylene and para-methylstyrene, and optionally a polyolefin polymer.

REFERENCES:
patent: 2516741 (1950-07-01), Young et al.
patent: 4143221 (1979-03-01), Naarmann et al.
patent: 4174358 (1979-11-01), Epstein
patent: 4350794 (1982-09-01), Moncur
patent: 4593066 (1986-06-01), Dean
patent: 5006601 (1991-04-01), Lutz et al.
patent: 5013789 (1991-05-01), Sakuma et al.
patent: 5063268 (1991-11-01), Young

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